High‐Throughput Fabrication of Flexible and Transparent All‐Carbon Nanotube Electronics
Yong‐Yang Chen; Yun Sun; Qian‐Bing Zhu; Bing‐Wei Wang; Xin Yan; Song Qiu; Qing‐Wen Li; Peng‐Xiang Hou; Chang Liu; Dong‐Ming Sun; Hui‐Ming Cheng
文献索引：10.1002/advs.201700965
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摘要
This study reports a simple and effective technique for the high‐throughput fabrication of flexible all‐carbon nanotube (CNT) electronics using a photosensitive dry film instead of traditional liquid photoresists. A 10 in. sized photosensitive dry film is laminated onto a flexible substrate by a roll‐to‐roll technology, and a 5 µm pattern resolution of the resulting CNT films is achieved for the construction of flexible and transparent all‐CNT thin‐film transistors (TFTs) and integrated circuits. The fabricated TFTs exhibit a desirable electrical performance including an on–off current ratio of more than 105, a carrier mobility of 33 cm2 V−1 s−1, and a small hysteresis. The standard deviations of on‐current and mobility are, respectively, 5% and 2% of the average value, demonstrating the excellent reproducibility and uniformity of the devices, which allows constructing a large noise margin inverter circuit with a voltage gain of 30. This study indicates that a photosensitive dry film is very promising for the low‐cost, fast, reliable, and scalable fabrication of flexible and transparent CNT‐based integrated circuits, and opens up opportunities for future high‐throughput CNT‐based printed electronics.