We are utilizing a new method to improve the dielectric properties of a conventional polymer using a recycled polymer product. The polyurethane foams are recycled by glycolysis process and the derived material was applied to improve the dielectric properties of the brittle DGEBA epoxy resin. Two main parameters that determine the applicability of the material as a dielectric (the dielectric constant and dielectric loss), were studied at room temperature for all the blends. The properties like dielectric constant and modulus were found to be very low by the inclusion of the different compositions of recycled polyurethane. 20 phr blend was selected for optimum properties and it shows a lower dissipation factor of 1.5 x10-2. The blends are advised as good candidates for the use in microelectronics as insulations, encapsulation and or circuit boards. We presented here an easy to process material with all the good properties require for a dielectric material. The thermal and dielectric data showed improvement than the neat polymers. The dielectric data was supported by the low water uptake of 0.5% by 20 phr blend and slightly increased contact angle from 63 to 77 degrees.