Electrochemically enabled manipulation of gallium-based liquid metals within porous copper
Jin-Lei Ma, Hao-Xuan Dong, Zhi-Zhu He
Index: 10.1039/C8MH00203G
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Abstract
A novel phenomenon of electrochemically enabled reactive wetting, coating and spreading of gallium-based liquid metals within porous copper (Cu) was observed, and its mechanism was demonstrated. Its extensive applications including in the fabrication of large-area conductive film patterns, transfer-printing technology and the preparation of thermal interface materials with superhigh heat conductivity are presented.
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