Tetrahedron Letters

Ligand free open air copper (II) mediated aryl formamidation and amination of aryl halides

R Komati, BS Jursic

Index: Tetrahedron Letters, , vol. 55, # 9 p. 1523 - 1527

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Abstract

... Please enable JavaScript to use all the features on this page. Tetrahedron Letters. Volume 55, Issue 9, 26 February 2014, Pages 1523–1527. Cover image Cover image. Ligand free open air copper(II) mediated aryl formamidation and amination of aryl halides. ...

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