A thermally remendable epoxy resin
Q Tian, YC Yuan, MZ Rong, MQ Zhang
Index: Journal of Materials Chemistry, , vol. 19, # 9 p. 1289 - 1296
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Citation Number: 106
Abstract
... The thermal reversibility of the DA bonds in cured DGFA proved to be workable below the glass transition temperature of the material. ... DS Bergman and F. Wudl, J. Mater. ... C. Dry and NR Sottos, in Smart Structures and Structures 1993: Smart Materials, ed. VK Varadian, Proc. ...
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