Wang resin

Suppliers

Names

[ CAS No. ]:
201058-08-4

[ Name ]:
Wang resin

[Synonym ]:
MFCD00131778
Wang resin

Chemical & Physical Properties

[ Density]:
1.117 g/cm3

[ Boiling Point ]:
386.2ºC at 760 mmHg

[ Molecular Formula ]:
C15H16O2

[ Molecular Weight ]:
228.28600

[ Flash Point ]:
175.2ºC

[ Exact Mass ]:
228.11500

[ PSA ]:
29.46000

[ LogP ]:
3.06630

[ Vapour Pressure ]:
1.18E-06mmHg at 25°C

[ Index of Refraction ]:
1.587

MSDS

Click to get detail MSDS

Safety Information

[ Hazard Codes ]:
Xn: Harmful;

[ Safety Phrases ]:
S24/25

[ HS Code ]:
3909400000

Customs

[ HS Code ]: 3909400000

Related Compounds

  • Brominated Wang resin
  • Fmoc-Ser(tBu)-Wang resin
  • Wang resin (100-200 mesh)
  • Fmoc-Lys(Mtt)-OH wang resin
  • Fmoc-Glycine, polymer-bound on Wang resin
  • 1-(3-acetoxy-olean-12-en-28-oyl)-4-methyl-piperazine
  • (S)-4-Cyano-2-hydroxybutanoic acid
  • Ast7NQ1gie
  • 1beta-Allyl-2alpha-phenylcyclopropane
  • 2-((1-methyl-1H-imidazol-2-yl)thio)propanamide
  • 4-(4-Cyclohexyl-2-methyloxazol-5-yl)-2-fluorobenzenesulfonyl chloride
  • 3-Chloro-2-(chloromethyl)phenyl isocyanate
  • Benzene, 1-(1-azidoethenyl)-2-(3-buten-1-yl)-
  • 1,1-Difluoro-4-phenyl-3-butene-2-ol
  • 1-(Chloromethyl)-2-(methylsulfanyl)benzene
  • 3,3-diphenyl-N-((1-(p-tolyl)-1H-tetrazol-5-yl)methyl)propanamide
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