Phenyl ester epoxy curative hybrid of bisphenol A structure
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Common Name | Phenyl ester epoxy curative hybrid of bisphenol A | ||
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CAS Number | 1071466-61-9 | Molecular Weight | 392.48700 | |
Density | 1.096g/mLat 25℃ | Boiling Point | N/A | |
Molecular Formula | C25H28O4 | Melting Point | N/A | |
MSDS | Chinese USA | Flash Point | >110°C | |
Symbol |
GHS07 |
Signal Word | Warning |
Name | [4-[1-(4-acetoxy-3-allyl-phenyl)-1-methyl-ethyl]-2-allyl-phenyl] acetate |
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Synonym | More Synonyms |
Density | 1.096g/mLat 25℃ |
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Molecular Formula | C25H28O4 |
Molecular Weight | 392.48700 |
Flash Point | >110°C |
Exact Mass | 392.19900 |
PSA | 52.60000 |
LogP | 5.32010 |
Storage condition | 2-8°C |
Symbol |
GHS07 |
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Signal Word | Warning |
Hazard Statements | H315-H317-H319-H335 |
Precautionary Statements | P261-P280-P305 + P351 + P338 |
Hazard Codes | Xi |
Risk Phrases | 36/37/38-43 |
Safety Phrases | 26-36-39 |
RIDADR | NONH for all modes of transport |
MFCD22200539 |