In 1863, two scientists C. Friedel and JM Crafts first synthesized the organosilicon compound tetraethylsilane (C2H5)4Si. Later in 1945, the direct synthesis of chlorosilanes under the action of catalysts established the foundation of the modern silicone industry. In 1947, a hydrosilylation reaction to form silicones, and a 1950 heat-shrinking process to produce silicone monomers, created conditions for the production of functional silicones. The organosilicon compound is abbreviated as "silicone", and one of the important types of elemental organic compounds refers to an organic compound containing a carbon-silicon bond in a molecular structure. Similar to the structure of organic carbon compounds, but also different from organic carbon compounds, there are only single bonds between silicon-silicon atoms in silicone molecules, and there are no double bonds and triple bonds. Simple types are silane, halosilane (such as CH3SiCl3), silanol [such as (CH3)3SiOH], and silyl ether [such as (CH3)3Si-O-Si(CH3)3]. It is customary to refer to certain silicon-containing compounds such as ethyl orthosilicate [(C2H5O)4Si], monosilane (SiH4) and the like as organosilicon compounds. These compounds have special properties, such as the ability to polymerize into polysiloxanes (the simplest polymer of the formula R3Si(OSiR2)n OSiR3], which has heat resistance, water resistance and good electrical insulation. It can be used to make silicone oil and silicone rubber. And silicone resin, etc. At normal temperature, most of the organosilicon compounds are colorless and transparent liquids, which have certain toxicity and corrosiveness. They are soluble in many organic solvents. When exposed to fire, high heat and oxidizing agents, they are easy to cause combustion and produce toxic fumes. Phenylsilane is exposed to water and water vapor to produce toxic and corrosive gases. It is mainly used as a reagent, water repellent, silicone intermediate and synthetic polymer organosilicon in industrial applications. The base silicide is classified as a flammable liquid, and the phenyl silicide is listed as a corrosive product. In addition to phenol silicide in the fire, it can be saved with water, foam, dry powder, 1211, carbon dioxide, and misty water. The main use of the introduction: The organosilicon compound can be directly applied as a monomer compound; it can also be hydrolyzed and polymerized to form a silicone polymer. It can be used as a silylating agent. It can also be used for surface coating of materials, moisture resistance of electrical insulating materials, anti-adhesion of particulate materials, organic synthesis and material separation. It is used as a coupling agent to improve resin or rubber and other materials. Adhesion, improve the mechanical properties and waterproof properties of plastics and rubbers; use as paint additives; other for hair growth drugs, anticancer drugs, etc. When applied in the form of polymers, silicone oil can be prepared (polymethylsiloxane) Alkane), used in cosmetics, lubricants, defoamers, hydrophobic agents, leather softeners, mold release agents, heat transfer media, hydraulic oils, etc.; used in the form of silicone resin for insulating varnish, filler, inorganic fiber bonding Agent, water repellent, anti-corrosion coating, etc.; used as anti-aging elastic material in the form of silicone rubber, room temperature vulcanized silicone rubber can be used for potting material and compression molding; used as gas chromatography and mass spectrometry; It is important that methyl and phenylchlorosilanes, such as monochlorosilanes, especially trimethylchlorosilane, play an important role in organic synthesis and biochemistry; methylpolysiloxanes are cosmetics and hair conditioners. An important component is also an important component of the antifoaming agent. In addition to the above, the organosilicon compound can also be used as a reducing agent, a protective agent for a reactive group, a selective electrophilic substitution reaction substrate, and a Peterson reagent in terms of organic synthesis.


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  • CAS Number: 4668-00-2
  • MF: C3H9ClO3Si
  • MW: 156.640
  • Catalog:Organosilicon compound
  • Density: 1.1±0.1 g/cm3
  • Boiling Point: 75.7±9.0 °C at 760 mmHg
  • Melting Point: 75.7C
  • Flash Point: 2.2±10.8 °C
  • CAS Number: 7803-62-5
  • MF: H4Si
  • MW: 32.11730
  • Catalog:Organosilicon compound
  • Density: 1.114
  • Boiling Point: -112ºC
  • Melting Point: -185ºC
  • Flash Point: N/A
  • CAS Number: 999-97-3
  • MF: C6H19NSi2
  • MW: 161.393
  • Catalog:Organosilicon compound
  • Density: 0.8±0.1 g/cm3
  • Boiling Point: 126.0±9.0 °C at 760 mmHg
  • Melting Point: -78 °C
  • Flash Point: 30.0±18.7 °C
  • CAS Number: 27804-64-4
  • MF: C8H22N2Si
  • MW: 174.35900
  • Catalog:Organosilicon compound
  • Density: 0.804
  • Boiling Point: 188.5±23.0 ºC (760 Torr)
  • Melting Point: N/A
  • Flash Point: 67.8±22.6 ºC
  • CAS Number: 993-00-0
  • MF: CH5ClSi
  • MW: 80.58890
  • Catalog:Organosilicon compound
  • Density: N/A
  • Boiling Point: N/A
  • Melting Point: 718 °C(lit.)
  • Flash Point: N/A
  • CAS Number: 17256-27-8
  • MF: C7H17ClO3Si
  • MW: 212.74700
  • Catalog:Organosilicon compound
  • Density: N/A
  • Boiling Point: N/A
  • Melting Point: N/A
  • Flash Point: N/A
  • CAS Number: 80-10-4
  • MF: C12H10Cl2Si
  • MW: 253.199
  • Catalog:Organosilicon compound
  • Density: 1.204
  • Boiling Point: 305.0±11.0 °C at 760 mmHg
  • Melting Point: -22 °C
  • Flash Point: 155 ºC
  • CAS Number: 556-67-2
  • MF: C8H24O4Si4
  • MW: 296.616
  • Catalog:Organosilicon compound
  • Density: 1.0±0.1 g/cm3
  • Boiling Point: 175.0±0.0 °C at 760 mmHg
  • Melting Point: 17-18 °C(lit.)
  • Flash Point: 63.2±23.0 °C
  • CAS Number: 947-42-2
  • MF: C12H12O2Si
  • MW: 216.308
  • Catalog:Organosilicon compound
  • Density: 1.2±0.1 g/cm3
  • Boiling Point: 352.6±25.0 °C at 760 mmHg
  • Melting Point: 144-147 °C
  • Flash Point: 167.1±23.2 °C
  • CAS Number: 63148-58-3
  • MF: C11H16OSi
  • MW: 192.33000
  • Catalog:Organosilicon compound
  • Density: 1.05
  • Boiling Point: >140ºC 0.002mm Hg(lit.)
  • Melting Point: N/A
  • Flash Point: 620 °F
  • CAS Number: 186598-40-3
  • MF: C8H22N2Si
  • MW: 174.35900
  • Catalog:Organosilicon compound
  • Density: 0.816 g/cm3
  • Boiling Point: 167ºC
  • Melting Point: N/A
  • Flash Point: 30ºC
  • CAS Number: 115262-01-6
  • MF: C4H9BrF2Si
  • MW: 203.10100
  • Catalog:Organosilicon compound
  • Density: 1.306
  • Boiling Point: 108°C(lit.)
  • Melting Point: N/A
  • Flash Point: 46℃
  • CAS Number: 98-13-5
  • MF: C6H5Cl3Si
  • MW: 211.548
  • Catalog:Organosilicon compound
  • Density: 1.3±0.1 g/cm3
  • Boiling Point: 201.0±9.0 °C at 760 mmHg
  • Melting Point: -127°C
  • Flash Point: 87.5±13.4 °C
  • CAS Number: 75-79-6
  • MF: CH3Cl3Si
  • MW: 149.479
  • Catalog:Organosilicon compound
  • Density: 1.3±0.1 g/cm3
  • Boiling Point: 73.5±3.0 °C at 760 mmHg
  • Melting Point: -77 °C
  • Flash Point: -15.0±0.0 °C
  • CAS Number: 75-54-7
  • MF: CH4Cl2Si
  • MW: 115.034
  • Catalog:Organosilicon compound
  • Density: 1.105 g/mL at 25 °C(lit.)
  • Boiling Point: 38.4±9.0 °C at 760 mmHg
  • Melting Point: -93 °C
  • Flash Point: -32.2±0.0 °C
  • CAS Number: 75-77-4
  • MF: C3H9ClSi
  • MW: 108.642
  • Catalog:Organosilicon compound
  • Density: 0.9±0.1 g/cm3
  • Boiling Point: 58.7±9.0 °C at 760 mmHg
  • Melting Point: −40 °C(lit.)
  • Flash Point: -27.8±0.0 °C
  • CAS Number: 75-78-5
  • MF: C2H6Cl2Si
  • MW: 129.061
  • Catalog:Organosilicon compound
  • Density: 1.1±0.1 g/cm3
  • Boiling Point: 70.0±0.0 °C at 760 mmHg
  • Melting Point: -76 °C
  • Flash Point: -16.1±0.0 °C
  • CAS Number: 1066-40-6
  • MF: C3H10OSi
  • MW: 90.196
  • Catalog:Organosilicon compound
  • Density: 0.8±0.1 g/cm3
  • Boiling Point: 75.0±9.0 °C at 760 mmHg
  • Melting Point: -11.99 °C
  • Flash Point: -0.9±18.7 °C
  • CAS Number: 4206-75-1
  • MF: C6H7ClSi
  • MW: 142.65800
  • Catalog:Organosilicon compound
  • Density: 1.070 g/mL at 25 °C(lit.)
  • Boiling Point: 165.5ºC at 760mmHg
  • Melting Point: N/A
  • Flash Point: 53.9ºC
  • CAS Number: 107-46-0
  • MF: C6H18OSi2
  • MW: 162.378
  • Catalog:Organosilicon compound
  • Density: 0.8±0.1 g/cm3
  • Boiling Point: 100.9±8.0 °C at 760 mmHg
  • Melting Point: −59 °C(lit.)
  • Flash Point: -1 ºC